Simulate thermal conductivity on CT scans of different materials using the Transport Phenomena Simulation Module for VGSTUDIO MAX.
Thermal conductivity measures a material's ability to allow the transport of heat.
The Transport Phenomena Simulation Module for VGSTUDIO MAX:
The thermal conductivity module is based on the following differential equations for stationary temperature and heat flux fields in a two-component material
where Ω is the entire simulation domain and Ωₐ is the domain of component a (with a = 1, 2). It is assumed that Ω₁ and Ω₂ do not overlap and their union equals Ω. T is the temperature, φ is the heat flux, kₐ is the thermal conductivity of component a, Δ is the Laplace operator, and grad is the gradient operator.
In experiment mode, the software performs a virtual experiment on the CT data of a structure, simulating the transport of heat through the structure from an inlet plane towards an outlet plane parallel to each other. Sealed or embedded boundary conditions perpendicular to the inlet and outlet plane can be defined. A temperature difference must be specified as driving quantity for the flow.
In tensor mode, the software calculates the effective tensor-valued thermal conductivity. The calculation of the thermal conductivity tensor can be done on the whole structure or for increments of the structure by means of an integration mesh.
In addition to the tensors' eigenvalues and eigenvectors, the components of the effective thermal conductivity tensor with respect to the simulation coordinate system are provided in a table view.