Micro BGA
Project details
- challenge: quality control of solder points and bonding wires of a grid array
- industry: electronics production
Technology
- software: VGStudio MAX with add-on modules Coordinate Measurement and Porosity/Inclusion Analysis
- data capturing: standard x-ray CT system for electronics manufacturing
Data set size
- total quantity of scanned data: a few GB
- resolution: depending on scan and assembly size
As a consequence of progressing miniaturization in the electronics industry, an increasing number of inaccessible solder points have to be examined (e.g. on BGAs). These solder points can no longer be examined using conventional optical methods. Using an x-ray CT system in connection with VGStudio MAX instead of a simple radiographic examination, critical quality parameters can be evaluated even on highly integrated assemblies.
In addition to a mere visual examination of the bond wire parameters, a qualitative 3D analysis can be performed in VGStudio MAX. Besides automatic detection of voids within the BGA balls, VGStudio MAX provides the complete functionality of coordinate measurement for evaluation in electronics production.
A CT scan and VGStudio MAX thus provide a comprehensive quality tool allowing the quality of solder points to be examined during production and a damage analysis to be performed if necessary.
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